Semiconductor Technology

Micro electroplating on semiconductor wafers: higher performance, higher clock rates and higher heat loads on increasingly smaller components require new processes. The preferred medium for the printed circuits is copper, being an excellent conductor for electricity and heat.

technotrans units and process technology offer a standardized solution for two and three dimensional applications such as packaging, via hole filling and system-on-chip.

Electroplating and wet process technology play an increasingly important part in the semiconductor production chain. Particularly with regard to wafer level packaging where increasingly copper is used for the production of minute structures on semiconductor chips.

Printed circuits, condensers, micro coils or micro-electronic connections are just a few of the components, where copper is displacing aluminium. In the so-called "via hole filling" with copper, stacked chips are electrically connected by vertical tunnel contacts.

This wafer level packaging enables compact three-dimensional forms for complex circuit connections, fast signal transmission and minimal electrical loss.